Light Avenue offers the possibility to bond our LED-/ VCSEL dice on standard star boards. In order to protect the dice we also develop a solution to add a glass cover on each chip.
The circuit board design will be used in our rapid prototyping process, also lenses can be added.
Du to this approach we experience several advantages:
- The handling of a 21x20 mm boards allow more space to e.g. bond more dice (1-4 dice) with different wavelengths, size and polarity…
- Each bonded LED chip can be driven individually
- We achieve a very good heat management due to high quality metal core printed circuit boards from our quality partner